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Helion wins $175M CHIPS Act award to build U.S. high-voltage pulsed semiconductor production for fusion plants

1 fonte(s) · 1 atualização(ões) · publicado 22/10/2026 11:59 · coletado há 1 dia

Helion, a fusion startup, announced a three-year, $175 million award from the U.S. Department of Commerce under the CHIPS Act. The money will fund R&D and manufacturing of advanced semiconductors and power electronics for its fusion power plants. Helion also disclosed a new $50 million private investment from an undisclosed investor, bringing total funding to more than $3.2 billion. This is industry and funding news with no cyber threat content, vulnerability or incident.

Detalhes técnicos

  • A new production line in Washington State is intended to be the first in the U.S. to make high-voltage, pulsed power semiconductors.
  • More than $100 million is set aside for semiconductor and advanced packaging R&D in Washington. About $80 million will go to R&D in Vermont with GlobalFoundries.
  • Current devices lose about 5-10% of the electricity passing through them. Helion's CEO David Kirtley says halving that loss could double the fusion system's output.
  • The R&D will not reach the Orion plant, which is due to supply Microsoft by 2028. It is meant for later plants.

Linha do tempo

  1. techcrunch.com ↗ · pub. 22/10/2026 11:59 · coletado 22/10 13:00 primeiro registro

    Helion wins $175M CHIPS Act award to build U.S. high-voltage pulsed semiconductor production for fusion plants

    ler a análise desta fonte

    Helion, a fusion startup, announced a three-year, $175 million award from the U.S. Department of Commerce under the CHIPS Act. The money will fund R&D and manufacturing of advanced semiconductors and power electronics for its fusion power plants. Helion also disclosed a new $50 million private investment from an undisclosed investor, bringing total funding to more than $3.2 billion. This is industry and funding news with no cyber threat content, vulnerability or incident.

    Technical Details

    • A new production line in Washington State is intended to be the first in the U.S. to make high-voltage, pulsed power semiconductors.
    • More than $100 million is set aside for semiconductor and advanced packaging R&D in Washington. About $80 million will go to R&D in Vermont with GlobalFoundries.
    • Current devices lose about 5-10% of the electricity passing through them. Helion's CEO David Kirtley says halving that loss could double the fusion system's output.
    • The R&D will not reach the Orion plant, which is due to supply Microsoft by 2028. It is meant for later plants.